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UID:dac_DAC 2026_sess317_RESEARCH799@linklings.com
SUMMARY:Mixed-structure Double-sided Redistribution Layer Routing for Glas
 s Interposer-based 5.5D ICs
DESCRIPTION:Haoyang Xu, Zhen Zhuang, and Leilei Jin (The Chinese Universit
 y of Hong Kong); Zheng Yang (Georgia Institute of Technology); Chen Wu (Ni
 ngbo Institute of Digital Twin); Lei He (The Eastern Institute for Advance
 d Study, Eastern Institute of Technology); Sung Lim (USC); and Tsung-Yi Ho
  (The Chinese University of Hong Kong)\n\nGlass interposers enable 5.5D ch
 iplet stacking, offering an advance beyond silicon-based technology. Howev
 er, routing in such dense, double-sided environments is challenging, and e
 xisting methods do not account for glass interposer design rules. To addre
 ss this, we propose a 5.5D RDL routing algorithm. It begins by allocating 
 routing resources, employs double-sided global routing for efficient guida
 nce, and uses a novel pixel-based detailed routing to finalize results. Ex
 periments show the proposed method achieves 100% routability and reduces w
 irelength by 37% compared to a 2.5D RDL router.\n\nTrack: EDA7-II. Physica
 l Design and Verification, Design\n\nSession Chairs: Christian Pilato (Pol
 itecnico di Milano); Mohsen Imani (University of California, Irvine); Flav
 io Ponzina (San Diego State University); Amin Farshidi (Cadence Design Sys
 tems, Inc.); Yonggan Fu (Georgia Institute of Technology, NVIDIA); Dimitri
 os Tsaras (Huawei, Hong Kong University of Science and Technology (HKUST))
 ; Anh Nguyen (Fujitsu Limited); Ruiyang Qin (Villanova University); Jilian
 g Zhang (Hunan University); Meng Li (Peking University); and Rassul Bairam
 kulov (Advanced Micro Devices (AMD))\n\n
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