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DTSTAMP:20260730T152640Z
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DTSTART;TZID=America/Los_Angeles:20260728T173900
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UID:dac_DAC 2026_sess306_LBR154@linklings.com
SUMMARY:Late Breaking Results: Toward a Foundation Model for 3DIC Thermal 
 Analysis and Beyond
DESCRIPTION:Akhilesh Kumar (Synopsys); Zelin Lu (University of Maryland, C
 ollege Park); Norman Chang (Synopsys); Igor Markov (NVIDIA); Lang Lin, Jes
 sica Yen, Haoliang Jiang, Wenbo Xia, and Yujing Luo (Synopsys); and Gang Q
 u (Univ. of Maryland, College Park)\n\nThermal management in 3DIC designs 
 is critical due to high power density from vertically stacked dies. While 
 FEM-based thermal analysis provides accurate results, it is computationall
 y prohibitive for design space exploration. We present a generic 3DIC mult
 i-physics foundation model architecture that structurally supports multi-m
 odal 3DIC inputs and task-specific decoders. We instantiate this architect
 ure for 3DIC thermal analysis, supporting arbitrary HTC distributions, des
 ign sizes, and power patterns. Our model achieves 7% MAPE compared with go
 lden FEM simulations on unseen cases. Compared to an FEM solver (2 hours, 
 16GB), our approach runs in <1 second using 8MB, achieving a 7200X speedup
  with a 2000X memory reduction for a representative test case.\n\nTrack: S
 tudent\n\n
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