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DTSTAMP:20260730T152640Z
LOCATION:Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20260728T174000
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UID:dac_DAC 2026_sess306_LBR049@linklings.com
SUMMARY:Late Breaking Results: 3D Analytical Placement with Smoothed Multi
 -die Wirelength Model
DESCRIPTION:Xingyu Tong (Fudan University), Chih-Jung Hsu (National Taiwan
  University), Guohao Chen (Fudan University), Yin-Hsuan Hung (National Tai
 wan University), Jianli Chen (Fudan University), and Yao-Wen Chang (Nation
 al Taiwan University)\n\nHeterogeneous integration via hybrid bonding opti
 mizes power, performance, and area (PPA) in multi-die systems. A core chal
 lenge is assigning circuit blocks to dies in different process technologie
 s. Existing analytical formulations employ smoothly varying sigmoid proxie
 s, causing assignment oscillation, or hard step functions that undermine r
 obustness. We introduce a soft die indicator based on a piecewise-smooth s
 urrogate with a strategically scheduled gradient decay, preserving early d
 ifferentiability while progressively sharpening decisions. Building on thi
 s indicator, we develop (i) a smoothed multi-die wirelength model consider
 ing pins on both inside and on net bounding boxes to guide optimization pr
 ecisely, unlike most previous models considering only pins on the boxes, a
 nd (ii) a size-compensated density formulation for heterogeneous dimension
 s. An adaptive preconditioner further balances gradients between macros an
 d standard cells. Experimental results on the 2023 ICCAD CAD Contest bench
 marks show that our placer achieves the smallest inter-die wirelength and 
 fastest runtime among published academic placers.\n\nTrack: Student\n\n
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