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DTSTAMP:20260730T152729Z
LOCATION:DAC Pavilion\, Exhibit Floor
DTSTART;TZID=America/Los_Angeles:20260728T170000
DTEND;TZID=America/Los_Angeles:20260728T180000
UID:dac_DAC 2026_sess295_ENGPOST111@linklings.com
SUMMARY:Design Verification Automation (DVA) for PCB Signal and Power Inte
 grity
DESCRIPTION:Sherif Amer, Adam El-Mansouri, Colton Love, Garrett Stauffer, 
 and Tracey Windley (Schweitzer Engineering Labs)\n\nModern PCB designs con
 tain thousands of signal nets operating up to multi-GHz frequencies, coupl
 ed with components requiring tight supply tolerances and increasing power 
 demands through complex power distribution networks. These designs require
  comprehensive signal and power integrity (SIPI) verification to achieve f
 irst-pass design success and minimize board iterations. However, tradition
 al SIPI workflows create significant bottlenecks, requiring extensive elec
 tromagnetic (EM) extraction and simulation setup expertise and manual inte
 rvention across multiple tool interfaces. Conventional analysis consumes w
 eeks to months per design iteration while limiting verification to special
 ized engineers—a critical constraint for organizations.\nThis work present
 s an integrated SIPI verification framework that automates the complete wo
 rkflow from EM extraction through circuit simulation to performance evalua
 tion. The methodology introduces: (1) automated mesh generation and solver
  configuration reducing setup time from hours to minutes, (2) template-bas
 ed circuit testbenches enabling seamless SPICE and IBIS model integration 
 with extracted parasitic networks, and (3) automated post-processing with 
 customizable pass/fail criteria and standardized reporting templates.\nVal
 idation across several production board designs demonstrates reduction in 
 revision time from 24% to 3% while achieving 100% first-pass prototype suc
 cess rate. This framework enables engineers with basic SIPI knowledge to p
 erform comprehensive verification and optimization, expanding team capacit
 y and design coverage.\n\nTopics: AI, Chiplet, Design, EDA, Quantum, Secur
 ity, Systems\n\n
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