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DTSTAMP:20260730T152727Z
LOCATION:DAC Pavilion\, Exhibit Floor
DTSTART;TZID=America/Los_Angeles:20260728T170000
DTEND;TZID=America/Los_Angeles:20260728T180000
UID:dac_DAC 2026_sess295_ENGPOST108@linklings.com
SUMMARY:A Novel Design Approach for Optimized EMC and Thermal Performance 
 in Next-Generation Automotive Applications
DESCRIPTION:Takuya Suzuki (DENSO) and Lih-Jen Hou and YuLing Lin (Siemens)
 \n\nWith the ongoing advancement of automotive intelligence, vehicles are 
 incorporating an increasing number of semiconductor chips to improve effic
 iency and functionality. This technological progression results in elevate
 d current levels across automotive systems, leading to two key physical ch
 allenges: electromagnetic compatibility (EMC) and thermal management. Prop
 erly managing these factors is crucial for ensuring system stability and r
 eliability.\n\nHowever, simultaneously addressing EMC and thermal effects 
 is complex, as their respective physical impacts and design requirements a
 re often conflicting. This complexity extends the design cycle needed to a
 chieve a suitable balance between EMC and thermal considerations that meet
 s chip specifications. To address this challenge, Denso and Siemens EDA ha
 ve partnered to develop an automated optimization workflow by integrating 
 Siemens' Solido Simulation Suite, HEEDS, and FLOEFD. This approach efficie
 ntly determines optimal design solutions for both EMC and thermal performa
 nce.\n\nUtilizing this innovative workflow can reduce design timelines by 
 up to 68% and decrease physical area requirements by as much as 20%. These
  improvements significantly accelerate time-to-market and lower costs asso
 ciated with circuit design for automotive applications.\n\nTopics: AI, Chi
 plet, Design, EDA, Quantum, Security, Systems\n\n
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