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PRODID:Linklings LLC
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TZID:America/Los_Angeles
X-LIC-LOCATION:America/Los_Angeles
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TZNAME:PDT
DTSTART:19700308T020000
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DTSTART:19701101T020000
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BEGIN:VEVENT
DTSTAMP:20260730T152727Z
LOCATION:DAC Pavilion\, Exhibit Floor
DTSTART;TZID=America/Los_Angeles:20260729T111500
DTEND;TZID=America/Los_Angeles:20260729T120000
UID:dac_DAC 2026_sess188_TT103@linklings.com
SUMMARY:From Hype to Impact: Where Agentic AI Actually Delivers Value in C
 hip Design Today
DESCRIPTION:William Wang (ChipAgentsAI) and Nimay Shah (Analog Devices, In
 c. (ADI))\n\nArtificial intelligence is now deeply embedded in the semicon
 ductor design conversation, but separating real engineering impact from as
 pirational hype remains a challenge for both technical and business leader
 s. This TechTalk provides a clear, grounded view of where Agentic AI is ac
 tually delivering measurable value in chip design workflows today, and whe
 re expectations still exceed practical reality.\n\nThe talk will examine c
 oncrete use cases across the design lifecycle, including architectural exp
 loration, RTL quality analysis, verification acceleration, physical design
  optimization, and design closure. Rather than focusing on specific tools 
 or products, the presentation will emphasize underlying techniques, deploy
 ment patterns, and organizational lessons learned from real-world adoption
 . Key questions addressed include: What types of design problems are well-
 suited for modern agentic AI approaches? Where do data availability and mo
 del generalization break down? How do teams integrate AI into existing EDA
  flows without disrupting proven methodologies?\n\nThe session will also e
 xplore the implications for engineering productivity, time-to-market, and 
 design risk, helping business stakeholders understand where Agentic AI inv
 estments pay off, and where caution is warranted. By bridging technical de
 pth with strategic insight, this TechTalk aims to equip DAC attendees with
  a realistic framework for evaluating and deploying AI in semiconductor de
 sign. This presentation aligns with DAC’s AI, Design, and EDA pillars and 
 is intended for design engineers, CAD managers, and technology decision-ma
 kers seeking practical guidance rather than marketing narratives.\n\nTopic
 s: AI\n\n
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