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Engineering Presentation
: Serving hot 3D-IC on clean and cool plates
Session Chair
Tim Helvey
Marvell
DescriptionExplore key concepts that support connectivity, performance and thermal management as 3D-ICs come into vogue for the next generation of dense computation built on vertical stacking.
Event Type
Engineering Presentation
TimeMonday, July 2710:30am - 12:00pm PDT
LocationSeaside RM 7
Topics
Chiplet
EDA
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