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Session

Engineering Poster
:
Engineering Poster Session One
Event Type
Engineering Poster
TimeMonday, July 275:00pm - 6:00pm PDT
LocationDAC Pavilion, Exhibit Floor
Topics
AI
Chiplet
Design
EDA
Quantum
Security
Systems
Presentations
Pss–enabled Design Space Exploration for Energy Management Systems
Risk Analysis for Chiplets, and Security Architecture
Advanced Automation for DC Die Generation and Verification
Enabling Time-Aware Systems Across Silicon-System Boundary
Next-Generation 3DIC STCO: AI-Enabled PPA and Cost Optimization Through IEEE P3537 3Dblox
Improving Software Libraries Used as Safety Diagnostics for DSPs with DCLS, in Next-Gen Battery Management Systems, to Achieve ASIL-D
Transforming Linux Drivers for Pre-Silicon Verification and Emulation Using Systemverilog DPI-C
Pre-Silicon Real Workloads Validation: Integration of Wireless Network Testers and Hardware Emulation via Virtualization
Implementing Secure Boot, Attestation and Secure Storage in Systems in Package
Research on Warpage Simulation Fitting, Stress Simulation Method and Glass Substrate Application of Advanced Package for AI Chips
Silicon Correlation of Voltage Droop Mitigation Scheme
Design Rule Checking for Rigid-Flex PCB
Enhancing Thermal Aware Optimization for 3D Heterogeneous Chiplets Integration: A System-Technology Co-Optimization (STCO) Perspective on Spatial-Temporal Temperature Uniformity
Automated 3Dblox File Generation: Enabling Extremely Rapid Solution Exploration by Streamlining Thermal and IR Analysis of 3D SOICs
Agentic Time-Travel Debugging for HLS Code
Pipeline-Based Denial of Service Attacks on Embedded RISC-V Core-Based Systems
A Security-Centric Virtual Platform for Accelerating Shift-Left Security Firmware Development
An Engineering Case Study of Autonomous AI PCB Layout Under Real Manufacturing and System Integration Constraints
Unifying Pre- and Post-Silicon Software Validation Through Modeling
SLURM Deployment for IC Design Startups. How to Make the Most of Slurm, and Avoid Common Issues
Solving Memory Subsystem Verification Challenges for Multi-Instance Designs
Advancing CDC Formal Verification in Low-Power SoCs Using Power Intent and Smart Waiver Techniques
Multi-Tiered Physical-Aware Formal: Ensuring Latency-Robustness in Power Management Architecture and Design
Design-for-FV Approach on a RISC-V Memory Page Walker
The New Era of Digital Verification: a Revolution Driven by Agentic AI Acceleration
Liberty-Based Profiling for IP Benchmarking
OoB Generator: A Novel Method to Improve the Productivity of RTL-to-Layout Using Python
SHELL: AI-Driven UVM Framework
Advanced Hard IP Integration Requirement Extraction and Checker
Innovative Multiplatform Framework Boosting 10BaseT Ethernet Verification for Next-Gen Automotive SoCs
Central DMA IP Verification Using Layered UVM Scoreboard
UCIe-A 64GT/s High Speed Integrated Design and SI/PI Comparison of CoWoS-S/L/R
Handling Timing Loops Across Non-Resettable Flops in a Synchronous Resets Design: An Innovative Technique
Matching Constraint Driven Synchronous Array Implementation for High-Performance ADCs
Invariant-Driven Contract-Based Formal Verification for Scalable Compositional Proofs
Multi-Agent Automated Formal Verification for Automative Applications
A Novel Automated Methodology Python Driven for Test Coverage Improvement via Fault Injection and Simulation
AI-Enabled High-Fidelity Power Amplifier Behavioral Modeling with Commercial EDA Tools
Bridging Hardware-Software Abstraction In UVM Verification
Adaptive Multi-Agent Framework for Automated Constraint Generation
Using Arm Native Acceleration with VLAB Virtual Platforms
Comprehensive Physical Verification Approach for Heterogeneous 2.5/3D Integration
A Mixed-Domain Modeling Approach for Hatched Ground Planes in 3D Chiplet Die-to-Die Interconnect
Scalable Hierarchical EMIR Analysis Using Multi Layered Abstraction for Reticle-Scale Data Centre SOCs
Advancing Silicon Lifecycle Management with Embedded Trace
Adaptive QoS Optimization for SoC Performance Enhancement Using Dueling Double Deep Q-Networks
Enabling PSS-Driven Early SoC Verification By Enriching IP-XACT Information
AI-Enhanced Early Thermal Aware Module Placement for 3DIC PPA Optimization
A Unified QA Framework for Intel Library Validation Using Siemens Solido Crosscheck
Automated Verification and Performance Analysis for Chiplets
Leveraging AI/ML Techniques for Memory Circuit Performance Optimization: Insights from ASO.ai
A Soft-Microcode Engine to Power the Next Wave of Edge Intelligence
Enabling Automated Software Testing in Emulation Environments via Fastboot Virtualization and On-Premises LLM-Based Failure Analysis
Optimizing Digital SOC Designs, One Cell at a Time Using AI Transistor-Level Sizing
A Probe-Based Time-Domain Methodology for Dynamic Thermal Management in Stacked-Die Architectures
Enabling Early Thermal Insight in Heterogeneous Integration Through Implementation-Driven Power Modeling
DFT Ready Design with SCO Canvas : Shift Left of DFT Designs
STEER: Simulation of Templates Engine for Efficient Resource Usage
Automated Validation of Liberty Models
A Hierarchical and Scalable Power Supply Network (PSN) Analysis Framework for FCBGA Packages in High-Power AI Applications
Scalable Verification Methodology for Stacked 3D Chiplet-Based Designs Using SIP Flow
UVM-MS: A Novel Approach to Mixed-Signal IP Verification
Shifting System-Level Verification Left with Firmware-Driven Execution
Optimizing Reliability EM Sign-Off for 2nm Mobile SoCs
Early Thermal Analysis and Silicon Correlation for Face-to-Face 3DIC Physical Design
Analysis of Power Delivery Network (PDN) in 12-High HBM 3DIC for Heterogeneous Integration
Advanced Hard IP Integration Requirement Extraction and Checker
Accelerating RTL and Verification Development via Automated Visual-to-Executable Specification Generation
A Service-Aware Energy-Efficient DVFS Framework for System-on-Chip Architectures
Progress-Based Timeout Debug for Scalable SoC Verification
Efficient IR-Aware Powergrid Optimization
Adaptive AI and Additive AI Techniques for High-Sigma Standard Cell Verification
Design Spec to Die-Size Estimation Using ML Based Framework for Automotive SoCs
Building an Ontology-Driven Knowledge Graph for Constraint-Aware Navigation of Semiconductor Design Documents
Architectural Coverage Analysis and ML-Based Automated-Test Generation
Physical Signoff at Scale: Tackling TSV, Interposer, and ESD in 3DIC Systems
First-Time-Right Power Analysis: Data-Driven Test Selection Through Real-Time Validation of Clocks, Gating and Traffic-Dependent Metrics
A Method to Automate the Conversion of .def File into .save.io One to Speed up the BE Digital Flow in Analog-on-Top Designs
Multi Level EMFI Analysis Flow Using Electromagnetic Field Solver and Chip PDN Model
ML-Based Sigma Av–aware Switch Cell Optimization
BSPDN: A Power Delivery Architecture for 19.8% Core Power Reduction and 9.3C Thermal Mitigation in Next-Generation AI Processors
Efficient Electromagnetic Extraction of Superconducting Circuits Used with Quantum Computers and Rapid Single Flux Quantum Designs
3DEM-Driven STA for Cross-Die Timing Signoff in 3DIC Chiplets Heterogeneous Integration
AI-Enabled EDA Cloud Infrastructure and Design Optimization for Next-Generation Semiconductor Design