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Session

Research Manuscript
:
Closing Integrity Faster: Physics- and Learning-Based Methods for Power, EM/IR, and Thermal
DescriptionThis session is about closing integrity faster by pairing physics-grounded models with learning-based methods that improve scalability and decision turnaround in real design flows. The papers span joint EM–IR modeling, robust simulation/solver techniques, and physics-informed learning that supports earlier screening and design-space exploration without disconnecting from electrical behavior. On the thermal side, the session highlights modular chiplet-oriented thermal modeling and cooling-aware prediction to surface hotspots and constraints earlier in the flow. Complementing these are constraint-aware P/G optimization and energy modeling for agile accelerator design. Together, these contributions emphasize practical, actionable integrity insights earlier, helping teams converge with fewer late surprises.
Event Type
Research Manuscript
TimeMonday, July 273:30pm - 5:30pm PDT
LocationMtg Room 202AB
Topics
EDA
Tracks
EDA4. Power Analysis and Optimization
Presentations
3:30pm - 3:42pm PDTGEMIR: Graph-Based Joint Modeling of Electromigration and IR Drop for Power Grid
3:42pm - 3:54pm PDTBLADE: Bi-Level Bayesian Optimization for Metal-Density-Constrained Multi-Layer Package Power/ground Plane Synthesis
3:54pm - 4:06pm PDTLEAP: A Self-Supervised Per-Cycle Toggle Propagation Model Supports Fast, Transferable, and Early Analysis of Layout Power
4:06pm - 4:18pm PDTPIANO: Physics-Informed Admittance Neural Operator for Fast Power Integrity Analysis
4:18pm - 4:30pm PDTEarly Design Stage Thermal Prediction and Optimization: Machine-Learning Driven Approach
4:30pm - 4:42pm PDTEastPCG: An Efficient and Self-Tuning Graph Sparsification Based PCG Solver for Circuit Simulation
4:42pm - 4:54pm PDTCOOL: A Cooling-Aware Point Transformer Framework for Thermal Prediction in Advanced 3D/3.5D IC Packaging
4:54pm - 5:06pm PDTCompilation Tells Energy: Rethinking Power Modeling for DNN Accelerator Agile Design
5:06pm - 5:18pm PDTLegotherm: Modular and Reusable Thermal Model for Chiplet-Based Heterogeneous Integration
5:18pm - 5:30pm PDTFLASH3D: A Fast Layered Analytical Solver for High-Accuracy Steady-State Thermal Simulation of 3D ICs