Presenter <Full Program · Contributors · Organizations · Search Program · Flagged · My Recommendations · Happening NowMore…Search ProgramFlaggedMy RecommendationsHappening NowChih-Hsiang YangIntelPresentationsEngineering PresentationAI-Enhanced Early Thermal Aware Module Placement for 3DIC PPA Optimization11:45am - 12:00pm PDT Monday, July 27 Seaside RM 7ChipletEDALate Breaking ResultsLate Breaking Results: Power Mesh Construction for 3D-IC with Backside Power Delivery6:27pm - 6:30pm PDT Monday, July 27 Exhibit Hall
