Presentation
Toward Self-Healing Interconnects in Advanced Packaging: Defect Analysis, Built-in Self-Test, and Repair
DescriptionThis talk will fous on how we can recover from defects in fanout wafer-level packaging (FOWLP) and hybrid bnding. Defects in FOWLP can arise from coefficient of thermal expansion mismatch, warpage, die shift, and post-molding protrusion, causing misalignment and imperfect bonding during redistribution layer (RDL) buildup. As a result, high-density back-end-of-line (BEOL) interconnects, RDLs, and through-mold vias are susceptible to warpage-induced stress, strain, and deformation. Hybrid bonding interfaces are vulnerable to nanoscale voids, contamination, and alignment-induced opens or shorts. The speaker will present an analysis of these defects, fault models, and impact of these defects on logic functionality and timing. The presentation showcase recent breakthroughs in built-in self-test and repair for FOWLP and hybrid bonding, translating cutting-edge academic research into practical solutions.
Event Type
Research Special Session
TimeMonday, July 272:30pm - 3:00pm PDT
LocationMtg Room 201A