Presentation
Advancements in Heterogeneous Integration and 3D Packaging for Next-Generation Scalable Photonic Integrated Systems
DescriptionIn this talk, AIM Photonics presents advances in heterogeneous integration and 3D packaging within 300 mm silicon photonics at the Albany Nanotech Complex. We highlight results from laser integration on PICs using 2.5D and monolithic bonding, offering dense integration capabilities. The talk also covers 3D co-packaged optics (CPO) architectures that lead to large gains in optical interconnect efficiency and bandwidth. Finally, we discuss unique features of our design automation offerings, including feature-rich photonic PDKs and Assembly Design Kit, enabling efficient, accurate circuit design and packaging. These innovations address key challenges in manufacturability, scalability, and yield for next-generation photonic AI systems.
Event Type
Research Special Session
TimeWednesday, July 292:30pm - 3:00pm PDT
LocationMtg Room 201A
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