Presentation
Mixed-Structure Double-Sided Redistribution Layer Routing for Glass Interposer-Based 5.5D ICs
DescriptionGlass interposers enable 5.5D chiplet stacking, offering an advance beyond silicon-based technology. However, routing in such dense, double-sided environments is challenging, and existing methods do not account for glass interposer design rules. To address this, we propose a 5.5D RDL routing algorithm. It begins by allocating routing resources, employs double-sided global routing for efficient guidance, and uses a novel pixel-based detailed routing to finalize results. Experiments show the proposed method achieves 100% routability and reduces wirelength by 37% compared to a 2.5D RDL router.
Event Type
Research Manuscript
TimeTuesday, July 284:30pm - 4:42pm PDT
LocationMtg Room 202AB