Close

Presentation

Unified Rail-Signal Co-Design for Multilayer PCBs: Resource Allocation, IR-Drop, and Routability
DescriptionThe growing demand for high-performance yet energy-efficient systems has elevated the need for coordinated power and signal routing in multilayer printed circuit boards (PCBs). While prior work optimizes either the power-delivery network (for DC IR-drop compliance) or signal routing (for routability), these separated flows often induce spatial contention and inefficient layer utilization. We propose the first unified rail-signal co-design framework for multilayer PCBs that jointly optimizes routing quality and power integrity. Our approach (1) generates routing guides to profile and allocate resources, (2) performs iterative rail-signal co-optimization that explicitly models crossing, overflow, and current density, and (3) conducts detailed routing via a guided, crossing-aware A* search that aligns with globally optimized guides. Experiments demonstrate that our proposed framework substantially improves routability while satisfying DC IR-drop constraints, delivering robust solutions with efficient resource usage.