Presentation
FLASH3D: A Fast Layered Analytical Solver for High-Accuracy Steady-State Thermal Simulation of 3D ICs
DescriptionHigh-accuracy thermal simulation is essential for modern 3D integrated circuits (ICs), but its high computational cost often hinders early-stage, thermal-aware design. To address this, we propose
FLASH3D, a fast and versatile analytical simulator for 3D steady-state thermal analysis. FLASH3D integrates spectral modal decomposition, the transfer matrix method, and an accelerated power decomposition algorithm to compute 3D temperature distributions efficiently and accurately. Compared with COMSOL, FLASH3D achieves over four orders of magnitude speedup, reducing computation time from minutes to milliseconds while maintaining a maximum absolute error below 0.5 K. Compared to the state-of-the-art machine learning (ML) method DeepOHeat, within a single inference time, FLASH3D can compute the temperature distribution of roughly 2000 slices and attains approximately 10× lower error. Furthermore, FLASH3D supports complex boundary conditions and fine-grained power maps, including curved-edge and standard-cell-level distributions, overcoming the limitations of conventional analytical methods. These features make FLASH3D an efficient, reliable, and scalable tool for early-stage thermal-aware design, providing a solid foundation for thermal optimization of large-scale 3D ICs.
FLASH3D, a fast and versatile analytical simulator for 3D steady-state thermal analysis. FLASH3D integrates spectral modal decomposition, the transfer matrix method, and an accelerated power decomposition algorithm to compute 3D temperature distributions efficiently and accurately. Compared with COMSOL, FLASH3D achieves over four orders of magnitude speedup, reducing computation time from minutes to milliseconds while maintaining a maximum absolute error below 0.5 K. Compared to the state-of-the-art machine learning (ML) method DeepOHeat, within a single inference time, FLASH3D can compute the temperature distribution of roughly 2000 slices and attains approximately 10× lower error. Furthermore, FLASH3D supports complex boundary conditions and fine-grained power maps, including curved-edge and standard-cell-level distributions, overcoming the limitations of conventional analytical methods. These features make FLASH3D an efficient, reliable, and scalable tool for early-stage thermal-aware design, providing a solid foundation for thermal optimization of large-scale 3D ICs.
Event Type
Research Manuscript
TimeMonday, July 275:18pm - 5:30pm PDT
LocationMtg Room 202AB