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Late Breaking Results: Toward a Foundation Model for 3DIC Thermal Analysis and Beyond
DescriptionThermal management in 3DIC designs is critical due to high power density from vertically stacked dies. While FEM-based thermal analysis provides accurate results, it is computationally prohibitive for design space exploration. We present a generic 3DIC multi-physics foundation model architecture that structurally supports multi-modal 3DIC inputs and task-specific decoders. We instantiate this architecture for 3DIC thermal analysis, supporting arbitrary HTC distributions, design sizes, and power patterns. Our model achieves 7% MAPE compared with golden FEM simulations on unseen cases. Compared to an FEM solver (2 hours, 16GB), our approach runs in <1 second using 8MB, achieving a 7200X speedup with a 2000X memory reduction for a representative test case.