Presentation
A Probe-Based Time-Domain Methodology for Dynamic Thermal Management in Stacked-Die Architectures
DescriptionDynamic Thermal Management (DTM) techniques are increasingly critical for high-power heterogeneous chip designs, where sustained peak operation can lead to rapid thermal limit violations. We present a dynamic, probe-based thermal methodology to quantitatively evaluate settling time post peak power events and maximize peak state duration. Design comprises of a compute die along with HBM placed on interposer and then package. Distinct tile based power map was created for peak and lower activity (50-90%) states. Static thermal analysis was performed to find the corresponding maximum temperatures.
Next using DTM analysis, the settling time was extracted, which is required for each lower power state to reach steady-state temperature after exiting the peak. This was exponentially inverse to power. Lastly, peak state duration between certain thresholds was maximized depending on the settling time of each state. Maximum peak state duration of 80% and 76% were seen for peak to 50% and 60% power states respectively. This methodology enables evaluation of transient metrics using DTM analysis by linking power throttling decisions directly to time-domain thermal behavior, providing actionable insights for DVFS, workload scheduling, and safe peak performance budgeting.
Next using DTM analysis, the settling time was extracted, which is required for each lower power state to reach steady-state temperature after exiting the peak. This was exponentially inverse to power. Lastly, peak state duration between certain thresholds was maximized depending on the settling time of each state. Maximum peak state duration of 80% and 76% were seen for peak to 50% and 60% power states respectively. This methodology enables evaluation of transient metrics using DTM analysis by linking power throttling decisions directly to time-domain thermal behavior, providing actionable insights for DVFS, workload scheduling, and safe peak performance budgeting.
Event Type
Engineering Presentation
TimeMonday, July 2711:30am - 11:45am PDT
LocationSeaside RM 7
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