Presentation
A Mixed-Domain Modeling Approach for Hatched Ground Planes in 3D Chiplet Die-to-Die Interconnect
DescriptionThe rapid growth of AI and machine-learning workloads has driven adoption of advanced packaging technologies such as silicon interposers, bridges, and heterogeneous 3D integration in chiplet-based systems. These structures often require patterned ground planes, such as hatched or meshed geometries, to meet manufacturability and reliability constraints. However, these geometries introduce significant challenges for signal and power integrity analysis due to impedance variation, increased loss, resonances, and crosstalk.
This paper presents a practical mixed-domain interconnect modeling approach that combines specialized quasi-static 2D field solvers with full-wave Finite Element Method (FEM) solvers to efficiently analyze hatched ground planes in advanced interconnects. The proposed approach is designed to integrate into back-end interconnect simulation flows, balancing modeling accuracy with scalability suitable for design iteration and signoff.
Two test vehicles, a UCIe 2.0–based silicon bridge and a mobile flex PCB, are fabricated, simulated, and correlated against measured data. The results demonstrate strong agreement with measurements while improving modeling efficiency compared to standalone 3D EM analysis, enabling more reliable interconnect analysis and faster design turnaround for advanced packaging implementations.
This paper presents a practical mixed-domain interconnect modeling approach that combines specialized quasi-static 2D field solvers with full-wave Finite Element Method (FEM) solvers to efficiently analyze hatched ground planes in advanced interconnects. The proposed approach is designed to integrate into back-end interconnect simulation flows, balancing modeling accuracy with scalability suitable for design iteration and signoff.
Two test vehicles, a UCIe 2.0–based silicon bridge and a mobile flex PCB, are fabricated, simulated, and correlated against measured data. The results demonstrate strong agreement with measurements while improving modeling efficiency compared to standalone 3D EM analysis, enabling more reliable interconnect analysis and faster design turnaround for advanced packaging implementations.
Event Type
Engineering Presentation
TimeMonday, July 2711:00am - 11:15am PDT
LocationSeaside RM 7