Presentation
BSPDN: A Power Delivery Architecture for 19.8% Core Power Reduction and 9.3C Thermal Mitigation in Next-Generation AI Processors
DescriptionThis work evaluates the performance and thermal benefits of Backside Power Delivery Networks (BSPDN) compared to traditional Frontside (FSPDN) architectures. Instead of push to max-performance, we proposed to focus on power efficiency. Our results demonstrate that BSPDN achieves a 19.8% reduction in power consumption under nominal operating conditions compared to FSPDN. Furthermore, the structural optimization of the power grid significantly enhances thermal dissipation, resulting in a 9.3°C reduction in peak operating temperature. These findings suggest that BSPDN is a critical enabler for next generation datacenter.
Event Type
Engineering Poster
TimeMonday, July 275:00pm - 6:00pm PDT
LocationDAC Pavilion, Exhibit Floor
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