Presentation
New Thermal Analysis Workflow for 3DIC Designs
DescriptionPower density and total power are higher in 3DIC designs compared to monolithic system on chip (SoC) designs, making thermal integrity a greater concern in 3DIC designs. Given the increased risk of thermal issues, thermal analysis must start from the early stages of a design and be progressively refined as the design matures. It is desirable to embed the thermal analysis in the same tool/platform that 3DIC designers use and have an option to import the same thermal design into a CFD tool, which system thermal experts are familiar with. This facilitates efficient collaboration between electronics designers and thermal experts. Traditional thermal analysis workflow starts only after the chip design is completed and hence not suitable for 3DIC design needs. This paper proposes a new workflow for thermal analysis for 3DIC designs leveraging Siemens IC-Packaging solutions and demonstrate its working on several representative Intel designs and process technologies.
Event Type
Engineering Poster
Engineering Presentation
TimeWednesday, July 293:00pm - 3:45pm PDT
LocationDAC Pavilion, Exhibit Floor