Presentation
Enhancing the Robustness of Impinj RAIN RFID Design Through the Application of AI-Powered Process Flow
DescriptionUHF RFID tagging is the fastest-growing segment of the RFID market, connecting billions of items worldwide. By enabling internet connectivity and real-time visibility into everyday objects—such as apparel, medical supplies, automotive parts, and food—Impinj RAIN RFID facilitates truly scalable Internet of Things (IoT) applications. As performance requirements for Impinj RAIN RFID systems continue to increase, designs must achieve higher sensitivity and accuracy while maintaining low power consumption. Meeting these performance requirements for billions of Impinj RAIN RFID tag chips presents significant verification challenges, where achieving high-sigma verification across all process, voltage, and temperature (PVT) corners typically requires a large number of simulations and hence long turnaround times.
To address these challenges, Impinj and Siemens EDA have collaborated on an advanced verification workflow that enables efficient high-sigma verification across PVT corners. Siemens EDA's Solido PVTMC tool intelligently identifies worst-case corners at higher sigma levels, significantly reducing the number of required simulations. When combined with the Solido SPICE simulator, this approach allowed Impinj to accelerate verification runtimes while meeting stringent accuracy and reliability targets. This presentation slide deck presents the workflow and highlights its impact on Impinj RAIN RFID design verification.
To address these challenges, Impinj and Siemens EDA have collaborated on an advanced verification workflow that enables efficient high-sigma verification across PVT corners. Siemens EDA's Solido PVTMC tool intelligently identifies worst-case corners at higher sigma levels, significantly reducing the number of required simulations. When combined with the Solido SPICE simulator, this approach allowed Impinj to accelerate verification runtimes while meeting stringent accuracy and reliability targets. This presentation slide deck presents the workflow and highlights its impact on Impinj RAIN RFID design verification.
Event Type
Engineering Poster
Engineering Presentation
TimeTuesday, July 285:00pm - 6:00pm PDT
LocationDAC Pavilion, Exhibit Floor
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