Presentation
Meeting EDA Workload Capacity Needs with AWS for Siemens' Solido Custom IC Technologies
DescriptionThe collaboration between AWS and Siemens addresses the critical challenge of matching variable electronic design automation (EDA) computing demand with static on-premise resources, which is both difficult and capital intensive. Siemens' Solido Intelligent Custom IC Verification, enabled by AWS cloud infrastructure, delivers massive scalability and accelerates project schedules, empowering engineering teams to efficiently manage fluctuating workloads. This partnership has resulted in the development of "cloud flight plans" for rapid deployment of Siemens' Solido Custom IC solutions on AWS, providing application notes, best practices, and direct deployment support. The reference flow for deploying on the cloud ensures accelerated time to deployment, optimized workflows, and direct collaboration between Siemens EDA and AWS experts. By leveraging cloud resources, organizations can minimize capital expenditures, maximize engineering productivity, and reduce time-to-market for custom IC designs. This approach not only streamlines deployment but also supports sustainable operations and risk reduction, making it a transformative solution for modern EDA challenges.
Event Type
Engineering Poster
Engineering Presentation
TimeTuesday, July 285:00pm - 6:00pm PDT
LocationDAC Pavilion, Exhibit Floor