Presentation
Automated 3Dblox File Generation: Enabling Extremely Rapid Solution Exploration by Streamlining Thermal and IR Analysis of 3D SOICs
DescriptionThe rapid evolution of 3DIC stacking technologies has unlocked new opportunities for scaling and system technology co-optimization. However, these technologies also bring increased power density and thermal impedance while simultaneously expanding the design space. In this environment, the consequences of early architectural decisions are magnified, the information available to make them is sparce, and speed is of the essence.
We present an automated 3Dblox-based solution that streamlines the generation and evaluation of multi-die architectures, enabling architects to rapidly prototype, analyze, and optimize complex 3D Multi-Chip Modules for thermal and IR performance. Our work builds upon an existing GUI-driven prototyping system which supports flexible floor planning and power density specifications without requiring RTL or netlist data. Here we integrate the generation of industry standard 3dbv, 3dbx, and 3dbf files for analysis with EDA tools.
By leveraging a combined internal and EDA tool flow, we reduce simulation turnaround time for thermal and IR feasibility from days to minutes. This approach identifies thermal and IR hotspots, facilitating better-informed design decisions early in the process. We demonstrate a scalable and practical methodology for early-stage 3DIC design, shifting critical analysis left in the development cycle and enabling broader, more rigorous exploration of next-generation system architectures.
We present an automated 3Dblox-based solution that streamlines the generation and evaluation of multi-die architectures, enabling architects to rapidly prototype, analyze, and optimize complex 3D Multi-Chip Modules for thermal and IR performance. Our work builds upon an existing GUI-driven prototyping system which supports flexible floor planning and power density specifications without requiring RTL or netlist data. Here we integrate the generation of industry standard 3dbv, 3dbx, and 3dbf files for analysis with EDA tools.
By leveraging a combined internal and EDA tool flow, we reduce simulation turnaround time for thermal and IR feasibility from days to minutes. This approach identifies thermal and IR hotspots, facilitating better-informed design decisions early in the process. We demonstrate a scalable and practical methodology for early-stage 3DIC design, shifting critical analysis left in the development cycle and enabling broader, more rigorous exploration of next-generation system architectures.
Event Type
Engineering Poster
TimeMonday, July 275:00pm - 6:00pm PDT
LocationDAC Pavilion, Exhibit Floor