Close

Organization

<
Hangzhou Zhicun (Witmem) Technology Co., Ltd.
Presentations
Engineering Poster Gladiator
3DEM-Driven STA for Cross-Die Timing Signoff in 3DIC Chiplets Heterogeneous Integration
5:17pm - 5:25pm PDT Tuesday, July 28 DAC Pavilion, Exhibit Floor
AI
Chiplet
Design
EDA
Quantum
Security
Systems
Engineering Poster
Enhancing Thermal Aware Optimization for 3D Heterogeneous Chiplets Integration: A System-Technology Co-Optimization (STCO) Perspective on Spatial-Temporal Temperature Uniformity
5:00pm - 6:00pm PDT Monday, July 27 DAC Pavilion, Exhibit Floor
AI
Chiplet
Design
EDA
Quantum
Security
Systems
Contributors
Yue Heng
Mingyang Liu
Runjian Wang