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Broadcom
Presentations
Engineering Presentation
Early Thermal Analysis and Silicon Correlation for Face-to-Face 3DIC Physical Design
11:15am - 11:30am PDT Monday, July 27 Seaside RM 7
Chiplet
EDA
DAC Pavilion Panel
Is EDA AI Delivering on Its ROI Promise?
4:00pm - 4:45pm PDT Tuesday, July 28 DAC Pavilion, Exhibit Floor
Research Panel
Is the EDA Industry Fundamentally Ill-Prepared for True 3D Heterogeneous Integration?
10:30am - 12:30pm PDT Tuesday, July 28 Mtg Room 104A
EDA
Contributors
Jason Crop
Dinesh Jayabharathi
AJ Tufano